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Diamond Wire for Sapphire, Silicon, Wafer, Semiconductor, Wire CuttingProducts Description & ApplicationDiamond wire is a type of fixed abrasive diamond wire. It's used for cutting Semiconductors material, such as silicon, sapphire. Based on the abrasion and cutting principle between the abrasive fixed on the steel wire and the workpiece materials, the abrasive particles do not directly act on the wire saw. Such rigid cutting method greatly improved the cutting efficiency.Diameter (mm)Core    wire (mm)Diamond    Grit(microns)Break    strength  (N)Length    of one spool  (KM)0.100.088~1035500.120.108~1045500.150.1210~1555500.250.1835~4095400.330.2535~40165400.390.3045~50235300.420.3345~50285300.450.3545~50320200.500.3850~6042520Advantages 1) Capable of cutting large-sized ingots; Material-saving, high-efficiency and cost-effective2) Capable of cutting materials with high rigidity and high brittleness such as sapphire3) Little damage on the processed surface, little deformation4) Thin slices, with uniform thickness.